Packaging in Electronics Production

Packaging technologies are extremely complex and demand manufacturing methods with exceptional precision in all process steps. Close control and optimization of all parameters ensure that quality and yield rates can be brought up to the required levels even in high-volume environments. The only way to accomplish this is with manufacturing equipment that‘s equally precise and efficient.

As the world’s largest equipment maker for the semiconductor industry, ASM Semiconductor Solutions offers the most comprehensive and innovative portfolio of solutions, as well as knowledge and experience needed to support your processes.

Your benefits: perfectly coordinated solutions from a single source. This will give you consistent process chains that make it possible to successfully implement each variant of modern packaging technologies, from product development to high-volume applications.

Packaging Electronics Production

Overall solutions

Integrated, aligned solutions for packaging in electronics manufacturing.

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Processes & Products

Whether you require sintering, camera lens alignment & testing, die bonding, wire bonding or molding, ASM covers every process step.

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The ASM team is looking forward to hearing from you.

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