Processes & Products

For processes like LED and CIS production, wafer and panel level packaging, system-in-package, smartcards, RFID, MEMS, discrete IC and power electronics, ASM has developed complete solutions that map these processes in their entirety.


A sintering innovation for power electronics: ASM SilverSAM - a single platform that can be used both in R&D activities and a multi-press configuration for high-volume production with pressure sintering applications.

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Camera Lens Alignment & Testing

Intelligent Advanced Driver Assistance Systems (ADAS) require a range of sensing technology radar, LiDAR and opto-electronic imaging sensors that must be robust, reliable and precise. One innovative solution for this is the ASM AUTOPIA.

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Die Bonding

As the world’s largest supplier of back end equipment, we offer a wide range of die bonding and flip chip solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, panel size and flexibility.

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Wire Bonding

One of the most important connection technologies in electronics. To accommodate ever smaller, more densely packaged components and new wire materials while meeting the need to become ever more efficient, including networking and monitoring every step, new solutions are needed. ASM Semiconductor Solutions offers them.

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The seemingly simple molding process gets complicated very quickly when you go into the details, and these details make all the difference. No matter what package, ASM can provide the best encapsulation solution.

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