Die Bonding
As the world’s largest supplier of semiconductor equipment, we offer a wide range of die bonding and flip chip solutions that perfectly support your prototype, small-lot or high-volume production while meeting all your requirements in terms of precision, speed, panel size and flexibility.
AD838L plus
Automatic Die Bonder for a wide range of applications
- Accuracy +/- 25µm @ 3S
- High precision configuration +/- 15µm @ 3S
- Substrate size: max 300x100mm
- UPH: up to 12.000
NUCLEUS
High Precision Wafer & Panel Level Bonder
- Die & Flip Chip capability
- Accuracy < +/-5µm @ 3S
- Panel Size max 340mm x340mm
- Multiple material handling approaches
- High temperature & high force bonding process
AD210 plus
Automatic Die Bonder for optical & photonic applications
- Die & Flip Chip capability
- Accuracy up to +/- 7µm @ 3S with local alignment
- Heated workholder option
- Dispensing capability
Related topics
Advanced Packaging with ASM
ASMPT's complete portfolio for wafer level and panel level packaging technologie.
Submicron Die & Flip-Chip Bonding
Highest precision for Photonic & Advanced Packaging applications.
