Pressure sintering with ASM SilverSAM
The core sintering process uses pressure, heat and time in material-specific combinations to permanently join the silver particles in the paste at temperatures that are far below the silver’s melting point. The ASM SilverSAM combines flexibility, productivity and quality of the sintered materials within one platform.
The innovative tooling in the ASM SilverSAM ensures an oxidation free sintering environment for handling copper materials in a vacuum or in a protective atmosphere (N2, HCOOH etc.). Furthermore, the tooling can be configured to exert pressure only to the desired surfaces (dies, chips, copper plates etc.) and keep cavities or grooves on the substrate untouched. A special film between the die and the tooling protects the components.
Flexibility and Scalability
The ASM tooling can handle all common substarte formats such as Master Card Panel, singulated DBC/AMB, leadframes or even heatsinks and wafers. The platform is configurable from one to three presses in a single ASM SilverSAM so that labs and prototype shops can be equipped with the smallest semi-automatic version, while high-volume factories can use the fully automated ASM SilverSAM version which is expandable with multiple presses for optimized throughput and productivity.